The TFM201608GHM-1R5MTAA is a wire wound chip inductor manufactured by TDK Corporation. It is designed for high-frequency applications and is characterized by its small size and excellent inductance stability.

Applications

• Mobile communication devices (smartphones, tablets)
• Wireless communication modules (Bluetooth, Wi-Fi)
• High-frequency power supplies
• RF circuits
• Noise filtering in signal lines

Features

• Small size (2.0 x 1.6 x 0.8 mm)
• Wire wound construction
• Inductance of 1.5 µH
• High Q factor
• Excellent inductance stability over temperature
• Surface mount design

Benefits

• Enables miniaturization of electronic devices
• Provides stable performance in high-frequency circuits
• Reduces noise and interference in signal lines
• Improves the efficiency of power supplies
• Suitable for automated assembly processes

Additional Details

The TFM201608GHM-1R5MTAA has an inductance value of 1.5 microhenries (µH) with a specified tolerance. The DC resistance (DCR) is an important parameter that affects the inductor's efficiency, with lower DCR values generally being preferred. The self-resonant frequency (SRF) indicates the frequency at which the inductor's behavior changes from inductive to capacitive; it should be significantly higher than the operating frequency. This inductor is used in RF matching circuits to optimize signal transfer, as well as in noise filtering applications to suppress unwanted electromagnetic interference (EMI). Its small size and surface mount configuration make it suitable for high-density circuit designs, where space is at a premium. The inductor's high Q factor indicates its ability to store energy efficiently, minimizing losses in the circuit. It is designed to withstand reflow soldering processes, ensuring reliable connections in automated assembly lines. The TFM201608GHM-1R5MTAA is a reliable choice for applications requiring small size, high performance, and excellent stability.