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Categoría Connectors, Interconnects - Backplane Connectors - Specialized
Fabricante Samtec Inc.
Serie *
Encapsulado Tray
Paquete estándar 15
Número de pieza Win Source 1337383-EBTM-6-08-2.0-S-VT-1-L
Amenaza de Falsificación en el Mercado Abierto 38 pct.
Modelo 3D de Ultra Librarian Ultra Librarian EBTM-6-08-2.0-S-VT-1-L Modelo CAD

Descripción

The EBTM-6-08-2.0-S-VT-1-L is a high-speed backplane connector from Samtec Inc., designed for demanding applications requiring reliable signal integrity and high-density interconnectivity. Part of the Edge Rate® series, it offers excellent electrical performance and a rugged design.

Applications:

  • High-speed backplane systems
  • Telecommunications equipment
  • Networking infrastructure
  • Data centers
  • Medical equipment

Features:

  • Edge Rate® contact system for optimized signal integrity
  • High-density design
  • Vertical orientation
  • 6 contacts
  • 2.0mm pitch
  • Through-hole termination
  • RoHS compliant

Benefits:

  • Ensures reliable high-speed data transmission with minimal signal degradation.
  • Maximizes board space utilization due to its high-density design.
  • Provides a secure and robust connection between boards.
  • Offers a cost-effective solution for backplane interconnects.
  • Complies with environmental regulations, ensuring responsible manufacturing.

Additional Details:

The Edge Rate® contact system is specifically designed to minimize broadside coupling, which reduces crosstalk and improves signal integrity. The vertical orientation allows for parallel board stacking, maximizing space utilization within the system. The 2.0mm pitch contributes to the high-density capabilities of the connector, enabling more signals to be routed within a given area. The through-hole termination provides a strong mechanical connection to the PCB.

This connector is often used in applications where signal integrity is critical and board space is limited. Samtec's reputation for quality and reliability makes this a popular choice for high-performance backplane systems. The EBTM series offers a range of options for different pin counts, orientations, and plating options, allowing designers to customize the connector to their specific needs.

Materials used in the connector construction typically include high-temperature thermoplastic insulators and beryllium copper or phosphor bronze contacts with gold or tin plating. These materials are selected for their electrical conductivity, mechanical strength, and resistance to corrosion. The connector is designed to withstand multiple mating cycles, ensuring long-term reliability.

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