The APM-12D23-20-DF8/TR8 is a surface-mount, high-power LED manufactured by Everlight Electronics Co Ltd. It is designed for applications requiring high brightness, energy efficiency, and long lifespan. This LED package is specifically engineered for optimal thermal management, ensuring reliable operation even under demanding conditions. The DF8/TR8 designation likely refers to the specific tape and reel packaging for automated assembly.

Applications

• Automotive Lighting: Including daytime running lights (DRLs), rear lights, and turn signals.
• Commercial Lighting: Such as streetlights, high-bay lighting, and architectural lighting.
• Industrial Lighting: Used in machine vision systems, inspection lighting, and task lighting.
• Signage and Displays: For both indoor and outdoor electronic displays.
• General Illumination: Replacement lamps and luminaires.

Features

• High Luminous Flux: Delivers a substantial amount of light output for its size.
• Low Thermal Resistance: Efficiently dissipates heat, improving reliability and extending lifespan.
• Surface Mount Device (SMD): Enables automated assembly and compact design.
• Wide Viewing Angle: Provides uniform light distribution.
• Long Lifespan: Designed for thousands of hours of operation.
• RoHS Compliant: Environmentally friendly, free of hazardous substances.

Benefits

• Energy Savings: Consumes less power than traditional lighting technologies.
• Reduced Maintenance Costs: Long lifespan minimizes the need for frequent replacements.
• Improved Visibility: High brightness and uniform light distribution enhance visibility.
• Design Flexibility: Compact size and surface mount design allow for greater design freedom.
• Enhanced Safety: Low heat generation reduces the risk of burns.

Additional Details

While specific electrical and optical characteristics (e.g., forward voltage, current, color temperature, luminous intensity) require referring to the official Everlight datasheet, high-power LEDs like the APM-12D23-20-DF8/TR8 typically require careful thermal management using heat sinks or other cooling solutions to maintain optimal performance and prevent premature failure. The packaging is designed to withstand reflow soldering processes used in automated assembly lines. The materials used are selected for high reliability and resistance to environmental factors such as humidity and temperature variations.